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Base material Criterion (µm)
Base Material
PI
Copper
Rolled annual copper foil
Electrolytic copper
Adhesive
Thickness of adhesive
No adhesive material
Cover Film
PI
FPC ink
Stiffener
PET
PI / Adhesive
FR4
Steel piece
Other
Adhesive
PSA (pressure-sensitive adhesive)
Hot pressure adhesive
Electromagnetic Film Silver film
12 20

25

9 Cu

12 PI

35 Cu

6

9

12

13 15

25

N/A
8 13

25

Green

Blue

Yellow
50~200

50 ~ 250

200 ~ 800

100

150

200
aluminum ceramic CEM
25 50 75
13 25 35
HSF-8000-2 AS-002 SF-PC-5900